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  lite-on dcc release lite-on technology corp. / optoelectronics no.90,chien 1 road, chung ho, new taipei city 23585, taiwan, r.o.c. tel: 886-2-2222-6181 fax: 886-2-2221-1948 / 886-2-2221-0660 http://www.liteon.com/opto smd ledproduct data sheetltst-s326gykt spec no.: ds22-2000-284effective date: 11/01/2014revision: c bns-od-fc001/a4 bns-od-fc001/a4 bns-od-fc001/a4 bns-od-fc001/a4
lite - on technology corporation p r o p e r t y o f l i t e - o n o n l y features * meet rohs . * side l ooking / dual c olor chip led with tin plating . * package in 8mm tape on 7" diameter reels. * eia std package. * i.c. compatible. * compatible with automatic placement equipment. * compatible with infrared reflow solder pr ocess. package dimensions devices part no. lens source color pin assignment ltst - s326gykt water clear gap on gap green c2 gaasp on gap yellow c1 notes: 1. all dimensions are in millimeters (in ches). 2. tolerance is 0.10 mm (.004") unless otherwise noted. part no. : ltst - s326gykt page : 1 of 12 bns - od - c131/a4
lite - on technology corporation p r o p e r t y o f l i t e - o n o n l y absolute maximum ratings at ta=25 ? c parameter ltst - s326gykt unit green yellow power dissipation 100 6 0 mw peak forward current (1/10 duty cycle, 0.1ms pulse width) 120 80 ma dc f orward c urrent 30 20 ma reverse voltage 5 5 v operating temperature range - 30 c to + 85 c storage temperature range - 40 c to + 85 c infra red soldering condition 260 c for 10 seconds part no. : ltst - s326gykt page : 2 of 12 bns - od - c131/a4
lite - on technology corporation p r o p e r t y o f l i t e - o n o n l y suggest ion profile: suggest ion ir reflow profile for pb free process part no. : ltst - s326gykt page : 3 of 12 bns - od - c131/a4
lite - on technology corporation p r o p e r t y o f l i t e - o n o n l y electrical / optical characteristics at ta=25 ? c parameter symbol ltst - s326gykt unit test condition green yellow luminous intensity iv min. 4.5 0 1.8 0 mcd if = 20 ma note 1 typ. 14.0 4.5 0 max. 28.0 11.2 viewing angle 2 ? 1/2 typ. 130 130 deg note 2 (fig.6) peak emission wavelength ? p typ. 565 585 nm measurement @peak (fig.1) dominant wavelength ? d typ. 569 588 nm if = 20 ma note 3 spectral line half - width ? ? typ. 30 35 nm f orward voltage vf typ. 2.1 2.1 v if = 20 ma max . 2.6 2.6 reverse current ir max . 10 10 ? a vr = 5v notes: 1. luminous intensity is measured with a light sensor and filter combination that approximates the cie eye - response curve. 2. 1/2 is the off - axis angle at which the luminous intensity is half the axial luminous intensity. 3. the dominant wavelength, d is derived from the cie chromaticity diagram and represents the single wavelength which defines the color of the device. 4. caution in esd: static electricity and surge damages the led. it is recommend to use a wrist band or anti - electrostatic glove when handling the led. all devices, equipment and machinery must be properly grounded. part no. : ltst - s326gykt page : 4 of 12 bns - od - c131/a4
lite - on technology corporation p r o p e r t y o f l i t e - o n o n l y part no. : ltst - s326gykt page : 5 of 12 bns - od - c131/a4 bin code list luminous intensity color : green , unit : mcd @20ma bin code min. max. j 4.5 0 7.1 0 k 7.1 0 11.2 l 11.2 18.0 m 18 .0 28.0 tolerance on each intensity bin is +/ - 15% luminous intensity color : yellow , unit : mcd @20ma bin code min. max. g 1.80 2.80 h 2.80 4.5 0 j 4.5 0 7.1 0 k 7.1 0 11.2 tolerance on each intensity bin is +/ - 15%
lite - on technology corporation p r o p e r t y o f l i t e - o n o n l y typical electrical / optical characteristics curves (25 ? c ambient temperature unless otherwise n oted) part no. : ltst - s326gykt page : 6 of 12 bns - od - c131/a4
lite - on technology corporation p r o p e r t y o f l i t e - o n o n l y cleaning do not use unspecified chemical liquid to clean led they could harm the package. if clean is necessary, immerse the led in ethyl alcohol or in isopro pyl alcohol at normal temperature for less one minute. suggest soldering pad dimensions suggest soldering direction: package dimensions of tape and reel notes: 1. all dimensions are in millimeters (inches). part no. : ltst - s326gykt page : 7 of 12 bns - od - c131/a4
lite - on technology corporation p r o p e r t y o f l i t e - o n o n l y notes: 1. empty component pockets sealed with top cover tape. 2. 7 inch reel - 3 000 pieces per reel. 3. min imum packing quantity is 500 pcs for remainders. 4. the maximum number of consecutive missing lamps is two. 5. in accordance with ansi/eia 481 specifications. part no. : ltst - s326gykt page : 8 of 12 bns - od - c131/a4
lite - on technology corporation p r o p e r t y o f l i t e - o n o n l y part no. : ltst - s326gykt page : 9 of 12 bns - od - c131/a4 caut ions 1. application the leds described here are intended to be used for ordinary electronic equipment (such as office equipment, communication equipment and household applications).consult liteons sales in advance 2. storage he package is sealed: the leds should be stored at 30c or less and 90%rh or less. and the leds are limited to use within one year, while the leds is packed in moisture - proof package with the desiccants inside. the package is opened: the storage ambient for the leds should not exceed 30c temperature or 6 0% relative humidity. it is recommended that leds out of their original packaging are ir - reflowed within one week . for extended storage out of their original packaging, it is recommended that the leds be stored in a sealed container with appropriate desiccant, or in a desiccators with nitrogen ambient. leds stored out of their original packaging for more than one week should be baked at about 60 deg c for at least 2 0 hours before solder assembly. 3. cleaning use alcohol - based cleaning solvents such as isopropyl alcohol to clean the led if necessary. 4. soldering recommended soldering conditions: reflow soldering wave soldering soldering iron pre - heat pre - heat time peak temperature soldering time 120~150c 120 sec. max. 240c max. 10 sec. max. pre - heat pre - heat time solder wave soldering time 100c max. 60 sec. max. 260c max. 10 sec. max. temperature soldering time 300c max. 3 sec. max. (one time only) s oldering notes: because different boar d designs use different number and types of devices, solder pastes, reflow ovens, and circuit boards, no single temperature profile works for all possible combinations. however, you can successfully mount your packages to the pcb by following the proper g uidelines and pcb - specific characterization . lite - on runs both component - level verification using in - house kyramx98 reflow chambers and board - level assembly. the results of this testing are verified through post - reflow reliability testing. profiles used at lite - on are based on jedec standards to ensure that all packages can be successfully and reliably surface mounted. figure on page3 shows a sample temperature profile compliant to jedec standards. you can use this example as a generic target to set up yo ur reflow process. you should adhere to the jedec profile limits as well as specifications and recommendations from the solder paste manufacturer to avoid damaging the device and create a reliable solder joint.
lite - on technology corporation p r o p e r t y o f l i t e - o n o n l y part no. : ltst - s326gykt page : 10 of 12 bns - od - c131/a4 5. drive method an led is a current - ope rated device. in order to ensure intensity uniformity on multiple leds connected in parallel in an application, it is recommended that a current limiting resistor be incorporated in the drive circuit, in series with each led as shown in circuit a below. circuit model a circuit model b (a) recommended circuit. (b) the brightness of each led might appear different due to the differences in the i - v characteristics of th ose leds. 6. esd (electrostatic discharge) static electricity or power surge will damage the led. suggestions to prevent esd damage: ? use of a conductive wrist band or anti - electrostatic glove when handling these leds. ? all devices, equipment, and machin ery must be properly grounded. ? work tables, storage racks, etc. should be properly grounded. ? use ion blower to neutralize the static charge which might have built up on surface of the leds forward voltage, or no lightup at low currents. to verify for esd damage, check for lightup and vf of the suspect leds at low currents. he vf of good leds should be >2.0v@0.1ma for ingan product and >1.4v@0.1ma for alingap led led
lite - on technology corporation p r o p e r t y o f l i t e - o n o n l y part no. : ltst - s326gykt page : 11 of 12 bns - od - c131/a4 7. reliability test classification test item test condition reference standard endurance test operation life ta= under room temperature as per dat a sheet maximum rating * test time= 1000hrs ( - 24hrs,+ 72hrs) mil - std - 750d:1026 mil - std - 883d:1005 jis c 7021:b - 1 high temperature high humidity storage ir - reflow in - board, 2 times ta= 655 ,rh= 90 95% * test time= 240hrs2hrs mil - std - 202f:103b jis c 7021: b - 11 high temperature storage ta= 1055 * test time= 1000hrs ( - 24hrs,+72hrs) mil - std - 883d:1008 jis c 7021:b - 10 low temperature storage ta= - 555 * test time=1000hrs ( - 24hrs,+72h rs) jis c 7021:b - 12 environmental test temperature cycling 105 25 - 55 25 30mins 5mins 30mins 5mins 10 cycles mil - std - 202f:107d mil - std - 750d:1051 mil - std - 883d:1010 jis c 7021:a - 4 thermal shock ir - reflow in - board, 2 times 85 5 - 40 5 10mins 10mins 10 cycles mil - std - 202f:107d mil - std - 750d:1051 mi l - std - 883d:1011 solder resistance t.sol= 260 5 dwell time= 10 1secs mil - std - 202f:210a mil - std - 750d:2031 jis c 7021:a - 1 ir - reflow pb free process ramp - up rate(217 to peak) +3 / second max temp. maintain at 175(25) 180 seconds max temp. maintain above 217 60 - 150 seconds peak temperature range 260 +0/ - 5 time within 5c of actual peak temperature (tp) 20 - 40 seconds ramp - down rate +6 /second max mil - std - 750d:2031.2 j - std - 020 c solderability t.sol= 235 5 immersion time 20.5 sec immersion rate 252.5 mm/sec coverage R 95% of the dipped surface mil - std - 202f:208d mil - std - 750d:2026 mil - std - 883d:2003 iec 68 part 2 - 20 jis c 7021:a - 2 8. others the appearance and specifications of the product may be modified for improvement without prior notice.
lite - on technology corporation p r o p e r t y o f l i t e - o n o n l y part no. : ltst - s3 26gykt page : 12 of 12 bns - od - c131/a4 9. suggested checking list training and certification 1. everyone working in a static - safe area is esd - certified? 2. training records kept and re - certification dates monitored? static - safe workstation & work areas 1. static - safe workstation or work - areas have esd signs? 2. all surfaces and objects at all static - safe workstation and within 1 ft measure less than 100v? 3. all ionizer activated, positioned towards the units? 4. each work surface mats grounding is good? personnel groundi ng 1. every person (including visitors) handling esd sensitive (esds) items wears wrist strap, heel strap or conductive shoes with conductive flooring? 2. if conductive footwear used, conductive flooring also present where operator stand or walk? 3. garments, hairs or anything closer than 1 ft to esd items measure less than 100v*? 4. every wrist strap or heel strap/conductive shoes checked daily and result recorded for all dls? 5. all wrist strap or heel strap checkers calibration up to date? note: *50v for bl ue led. device handling 1. every esds items identified by eia - 471 labels on item or packaging? 2. all esds items completely inside properly closed static - shielding containers when not at static - safe workstation? 3. no static charge generators (e.g. plasti cs) inside shielding containers with esds items? 4. all flexible conductive and dissipative package materials inspected before reuse or recycles? others 1. audit result reported to entity esd control coordinator? 2. corrective action from previous audits completed? 3. are audit records complete and on file?


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